PCB Layout design (SS, DS & ML up to 24 layers)
Single-sided, double-sided, and Multi-layer boards (up to 24 layers) with high density design handing capabilities.
Component Library creation as per IPC standard.
Design for Surface mount, through-hole & mixed technology with QFN, BGA, PGA & fine pitch components.
Design as per EMI/EMC requirement.
Design for manufacturability (DFM)
Design for Assembly (DFA)
Bill of material generation, Gerber generation, Stack up creation for multilayer.